Thermoelasticity and interdiffusion in CuNi multilayers-Reference-Cited by-同舟云学术

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Thermoelasticity and interdiffusion in CuNi multilayers

Published:2012-06-04 Issue:23 Volume:85 Page:
ISSN:1098-0121
Container-title:Physical Review B
language:en
Short-container-title:Phys. Rev. B

Author:

Benoudia M. C.,Gao F.,Roussel J.-M.,Labat S.,Gailhanou M.,Thomas O.,Beke D. L.,Erdélyi Z.,Langer G.,Csik A.,Kis-Varga M.

Publisher

American Physical Society (APS)

Subject

Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevB.85.235404/fulltext

Reference39 articles.

1. Selective X-Ray Diffraction from Artificially Stratified Metal Films Deposited by Evaporation

2. An X‐Ray Method of Determining Rates of Diffusion in the Solid State

3. Interface sharpening and broadening during annealing ofCu∕Nimultilayers: A kinetic Monte Carlo study

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2. Interface sharpening in miscible and isotopic multilayers: Role of short-circuit diffusion;Physical Review B;2019-05-10

3. Kinetics of interface alloy phase formation at nanometer length scale in ultra-thin films: X-ray and polarized neutron reflectometry;Progress in Materials Science;2018-07

4. Atomic scale analysis of phase formation and diffusion kinetics in Ag/Al multilayer thin films;Journal of Applied Physics;2016-11-21

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