A multi-scale interface-induced 3D percolation network in polymeric heterostructures for EMI shielding application-Reference-Cited by-同舟云学术

A multi-scale interface-induced 3D percolation network in polymeric heterostructures for EMI shielding application

Published:2025 Issue: Volume: Page:
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Sun Jiahao¹,Mao Lijian¹,Gao Zhenliang¹,Deng Lechun²,Chen Qiang²^ORCID,Li Yang¹,Liu Chuntai¹^ORCID,Shen Changyu¹,Liu Xianhu¹^ORCID

Affiliation:

1. National Engineering Research Center for Advanced Polymer Processing Technology, Zhengzhou University, Zhengzhou, 450002, China

2. State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, 710072, Xi’an, China

Abstract

Mechanical compounding and hot pressing were used to prepare a composite material. The material retains excellent EMI shielding capability under simulated harsh marine environments and enables highly flexible mechanical interlocking strategies.

Funder

Natural Science Foundation of Henan Province

Publisher

Royal Society of Chemistry (RSC)

Link

http://pubs.rsc.org/en/content/articlepdf/2025/TC/D5TC01738F

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