Recent advances in passive cooling materials for thermal management in flexible electronics-Reference-Cited by-同舟云学术

Recent advances in passive cooling materials for thermal management in flexible electronics

Published:2024 Issue:32 Volume:12 Page:12179-12206
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Li Jiyu¹²^ORCID,Zhou Yingying³,Jiang Cancheng⁴,Lei Dangyuan⁴^ORCID,Yu Xinge¹²^ORCID

Affiliation:

1. Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China

2. Hong Kong Center for Cerebra-Cardiovascular Health Engineering, Hong Kong Science Park, New Territories 999077, Hong Kong, China

3. College of Professional and Continuing Education, The Hong Kong Polytechnic University, Hong Kong SAR, China

4. Department of Materials Science and Engineering, Centre for Functional Photonics, and Hong Kong Branch of National Precious Metals Material Engineering Research Centre, City University of Hong Kong, Hong Kong, China

Abstract

Flexible electronics has been widely recognized as the future of electronics for a broad range of applications, which is also the foundation for wearable devices that can go or even seamlessly integrate with the human skin.

Funder

City University of Hong Kong

Research Grants Council, University Grants Committee

Innovation and Technology Commission - Hong Kong

National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Link

http://pubs.rsc.org/en/content/articlepdf/2024/TC/D4TC02523G

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5. Wearable electrochromic materials and devices: from visible to infrared modulation