Affiliation:
1. Shenzhen International Innovation Institutes of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
2. Department of Nano Science and Technology Institute, University of Science and Technology of China, Suzhou, 215123, China
Abstract
As stringent demands for PI materials with low-temperature curable properties have increased in the high-frequency communication era, the introduction of flexible structures has gained prominence for enhancing molecular chain mobility.
Funder
National Natural Science Foundation of China
Special Project for Research and Development in Key areas of Guangdong Province
Shenzhen Institutes of Advanced Technology Innovation Program for Excellent Young Researchers
National Science and Technology Major Project
Basic and Applied Basic Research Foundation of Guangdong Province
National Natural Science Foundation of China-Guangdong Joint Fund
Publisher
Royal Society of Chemistry (RSC)
Subject
Materials Chemistry,General Chemistry