Recent progress in eutectic gallium indium (EGaIn): surface modification and applications-Reference-Cited by-同舟云学术

Recent progress in eutectic gallium indium (EGaIn): surface modification and applications

Published:2024 Issue:2 Volume:12 Page:657-689
ISSN:2050-7488
Container-title:Journal of Materials Chemistry A
language:en
Short-container-title:J. Mater. Chem. A

Author:

Ge Wensong¹,Wang Rui¹,Zhu Xiaoyang¹^ORCID,Zhang Houchao¹,Sun Luanfa¹,Wang Fei¹,Li Hongke¹,Li Zhenghao¹,Du Xinyi¹,Chen Huangyu¹,Zhang Fan¹,Shi Huifa¹,Hu Huiqiang²,Xi Yongming²,He Jiankang³^ORCID,Hu Liang⁴,Lan Hongbo¹

Affiliation:

1. Key Laboratory of Additive Manufacturing and Applications in Universities of Shandong, Shandong Engineering Research Center for Additive Manufacturing, Qingdao University of Technology, Qingdao 266520, China

2. Department of Spinal Surgery, The Affilliated Hospital of Qingdao University, Qingdao 266003, China

3. Xi'an Jiaotong University, Xi'an 710049, China

4. Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry Chinese Academy of Sciences, Beijing 100190, China

Abstract

EGaIn plays an important role in flexible electronics, this paper focuses on a review of the key factors affecting the surface tension of liquid metals and surface modification methods and applications.

Funder

National Natural Science Foundation of China

Natural Science Foundation of Shandong Province

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science,Renewable Energy, Sustainability and the Environment,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2024/TA/D3TA04798A

Reference227 articles.

1. Recent Advances in Transparent Electronics with Stretchable Forms

2. Flexible Electronics: Stretchable Electrodes and Their Future

3. A Healable, Semitransparent Silver Nanowire-Polymer Composite Conductor

4. Surface modification of liquid metal as an effective approach for deformable electronics and energy devices

5. Highly stretchable multilayer electronic circuits using biphasic gallium-indium