Mushroom-mimetic 3D hierarchical architecture-based e-skin with high sensitivity and a wide sensing range for intelligent perception

Author:

Zhang Yajie1,Zhang Xinyu1,Ning Chuan1,Dai Kun1ORCID,Zheng Guoqiang1ORCID,Liu Chuntai1,Shen Changyu1

Affiliation:

1. School of Materials Science and Engineering, National Engineering Research Center for Advanced Polymer Processing Technology, Zhengzhou University, Zhengzhou 450001, P. R. China

Abstract

The present work proposes a facile fabrication technique to achieve 3D hierarchical architecture-based e-skin with excellent sensing performance that can monitor gestures and health conditions wirelessly, sense the trajectory of pressure stimuli.

Funder

National Natural Science Foundation of China

Science and Technology Innovation Talents in Universities of Henan Province

Publisher

Royal Society of Chemistry (RSC)

Subject

Electrical and Electronic Engineering,Process Chemistry and Technology,Mechanics of Materials,General Materials Science

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