Mushroom-mimetic 3D hierarchical architecture-based e-skin with high sensitivity and a wide sensing range for intelligent perception
Author:
Affiliation:
1. School of Materials Science and Engineering, National Engineering Research Center for Advanced Polymer Processing Technology, Zhengzhou University, Zhengzhou 450001, P. R. China
Abstract
Funder
National Natural Science Foundation of China
Science and Technology Innovation Talents in Universities of Henan Province
Publisher
Royal Society of Chemistry (RSC)
Subject
Electrical and Electronic Engineering,Process Chemistry and Technology,Mechanics of Materials,General Materials Science
Link
http://pubs.rsc.org/en/content/articlepdf/2023/MH/D3MH00679D
Reference58 articles.
1. Bio‐Inspired Artificial Perceptual Devices for Neuromorphic Computing and Gesture Recognition
2. Hollow-porous fibers for intrinsically thermally insulating textiles and wearable electronics with ultrahigh working sensitivity
3. Durable and Flexible Bio-assembled RGO-BC/BC Bilayer Electrodes for Pressure Sensing
4. On-skin paintable biogel for long-term high-fidelity electroencephalogram recording
5. Pressure Insensitive Strain Sensor with Facile Solution-Based Process for Tactile Sensing Applications
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