A novel high performance bismaleimide/diallyl bisphenol A (BMI/DBA)–epoxy interpenetrating network resin for rigid riser application-Reference-Cited by-同舟云学术

A novel high performance bismaleimide/diallyl bisphenol A (BMI/DBA)–epoxy interpenetrating network resin for rigid riser application

Published:2015 Issue:97 Volume:5 Page:79888-79897
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Jena R. K.¹²³,Yue C. Y.¹²³,Sk M. M.¹²³,Ghosh K.¹²³

Affiliation:

1. School of Mechanical and Aerospace Engineering

2. Nanyang Technological University

3. Singapore 639798

Abstract

A new class of interpenetrating network (IPN) resin system was developed by mixing tetrafunctional epoxy resin (TGDDM) with diallyl bisphenol A (DBA) modified bismaleimide (BMI) for rigid riser applications at high temperatures of more than 280 °C.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2015/RA/C5RA14474D

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