Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging-Reference-Cited by-同舟云学术

Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging

Published:2019-07-15 Issue:1 Volume:9 Page:
ISSN:2045-2322
Container-title:Scientific Reports
language:en
Short-container-title:Sci Rep

Author:

Shen Yu-An,Lin Chun-Ming,Li Jiahui,Gao Runhua,Nishikawa Hiroshi

Publisher

Springer Science and Business Media LLC

Subject

Multidisciplinary

Link

http://www.nature.com/articles/s41598-019-46757-w.pdf

Reference18 articles.

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3. Li, Z., Pradeep, K. G., Deng, Y., Raabe, D. & Tasan, C. C. Metastable high-entropy dual-phase alloys overcome the strength–ductility trade-off. Nature 534, 227–230 (2016).

4. Cheng, K.-C., Chen, J.-H., Stadler, S. & Chen, S.-H. Properties of atomized AlCoCrFeNi high-entropy alloy powders and their phase-adjustable coatings prepared via plasma spray process. Appl. Surf. Sci. 478, 478–486 (2019).

5. Ye, Y. F., Wang, Q., Lu, J., Liu, C. T. & Yang, Y. High-entropy alloy: challenges and prospects. Mater. Today 19, 349–362 (2016).

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