New solution of the partial differential equation of the grain groove profile problem in the case of evaporation/condensation
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/s41598-019-46537-6.pdf
Reference40 articles.
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4. Ramminger, S., Seliger, N. & Wachutka, G. Reliability Model for Al Wire Bonds subjected to Heel Crack Failures. Microelectron. Reliab. 40, 1521–1525 (2000).
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