Self-Rolled-Up Aluminum Nitride-Based 3D Architectures Enabled by Record-High Differential Stress-Reference-Cited by-同舟云学术

Self-Rolled-Up Aluminum Nitride-Based 3D Architectures Enabled by Record-High Differential Stress

Published:2022-06-14 Issue:25 Volume:14 Page:29014-29024
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Khandelwal Apratim¹^ORCID,Ren Zhongjie²^ORCID,Namiki Shunya¹,Yang Zhendong²,Choudhary Nitin³,Li Chao³,Wang Ping⁴^ORCID,Mi Zetian⁴^ORCID,Li Xiuling²^ORCID

Affiliation:

1. Department of Electrical and Computer Engineering, Holonyak Micro and Nanotechnology Laboratory, University of Illinois Urbana-Champaign, Urbana, Illinois 61801, United States

2. Department of Electrical and Computer Engineering, Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States

3. Plasma-Therm LLC, 1051 North Fiesta Blvd., Suite 3, Gilbert, Maricopa, Arizona 85233, United States

4. Department of Electrical Engineering and Computer Science (EECS), University of Michigan, Ann Arbor, Michigan 48109, United States

Funder

National Science Foundation

Army Research Office

Semiconductor Research Corporation

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.2c06637