Anisotropic Thermal Diffusivity of Hexagonal Boron Nitride-Filled Polyimide Films: Effects of Filler Particle Size, Aggregation, Orientation, and Polymer Chain Rigidity-Reference-Cited by-同舟云学术

Anisotropic Thermal Diffusivity of Hexagonal Boron Nitride-Filled Polyimide Films: Effects of Filler Particle Size, Aggregation, Orientation, and Polymer Chain Rigidity

Published:2013-05-09 Issue:10 Volume:5 Page:4374-4382
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Tanimoto Mizuka¹,Yamagata Toshitaka²,Miyata Kenji²,Ando Shinji¹

Affiliation:

1. Department of Chemistry and Materials Science, Tokyo Institute of Technology, Ookayama, Meguro-ku, Tokyo 152-8552, Japan

2. Electronic Materials Research Department, Shibukawa Plant, Denki Kagaku Kogyo Kabushiki Kaisha, Nakamura, Shibukawa-shi, Gunma 377-8520, Japan

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/am400615z

Reference17 articles.

1. Berechnung verschiedener physikalischer Konstanten von heterogenen Substanzen. II. Dielektrizitätskonstanten und Leitfähigkeiten von Vielkristallen der nichtregulären Systeme

2. Rudimentary Finite Element Thermal Modeling of Platelet-Filled Polymer-Ceramic Composites

3. Impact of molecular orientation on thermal conduction in spin-coated polyimide films

4. Thermal diffusivity of aromatic polyimide thin films by temperature wave analysis

5. Molecular Structure Dependence of Out-of-Plane Thermal Diffusivities in Polyimide Films: A Key Parameter for Estimating Thermal Conductivity of Polymers

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