Modeling of Adhesion in Tablet Compression at the Molecular Level Using Thermal Analysis and Molecular Simulations-Reference-Cited by-同舟云学术

Modeling of Adhesion in Tablet Compression at the Molecular Level Using Thermal Analysis and Molecular Simulations

Published:2021-12-15 Issue:1 Volume:19 Page:26-34
ISSN:1543-8384
Container-title:Molecular Pharmaceutics
language:en
Short-container-title:Mol. Pharmaceutics

Author:

Chaturvedi Kaushalendra¹²³⁴,Shah Harsh S.¹³⁴^ORCID,Morris Kenneth R.¹³^ORCID,Dave Rutesh H.¹²^ORCID

Affiliation:

1. Department of Pharmaceutical Sciences, Arnold and Marie Schwartz College of Pharmacy, Long Island University, 75 Dekalb Avenue, Brooklyn, New York 11201, United States

2. Natoli Institute for Industrial Pharmacy Research and Development, Long Island University, 75 Dekalb Avenue, Brooklyn, New York 11201, United States

3. Lachman Institute for Pharmaceutical Analysis, Long Island University, 75 Dekalb Avenue, Brooklyn, New York 11201, United States

4. J-Star Research Inc., 6 Cedarbrook Drive, Cranbury, New Jersey 08512, United States

Publisher

American Chemical Society (ACS)

Subject

Drug Discovery,Pharmaceutical Science,Molecular Medicine

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.molpharmaceut.1c00527

Reference29 articles.

1. Compression Physics in the Formulation Development of Tablets

2. Evaluation of powder rheology as a potential tool to predict tablet sticking

3. Influence of Compression Pressure and Velocity on Tablet Sticking

4. Quantitative evaluation of tablet sticking by surface roughness measurement

5. Effect of lubricant type and concentration on the punch tip adherence of model ibuprofen formulations

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