The Failure Mechanism of Micro Thermoelectric Devices under the Action of the Temperature Field-Reference-Cited by-同舟云学术

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The Failure Mechanism of Micro Thermoelectric Devices under the Action of the Temperature Field

Published:2024-03-25 Issue:13 Volume:16 Page:16505-16514
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Lyu Jianan¹²,Yang Dongwang¹^ORCID,Liu Yutian¹,Li Junhao¹,Zhang Zinan¹,Li zhenming³,Liu Mingyang³,Liu Wei³,Ren Zhigang⁴,Liu Hongjing⁴,Wu Jinsong¹²^ORCID,Tang Xinfeng¹^ORCID,Yan Yonggao¹

Affiliation:

1. State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China

2. Nanostructure Research Center, Wuhan University of Technology, Wuhan 430070, China

3. Energy Storage and Electrotechnics Department, China Electric Power Research Institute, Beijing 100192, China

4. SGCC Beijing Electric Power Research Institute, Beijing 100075, China

Funder

State Grid Corporation of China

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.4c00625

Reference51 articles.

1. Biomass‐based biomimetic‐oriented Janus nanoarchitecture for efficient heavy‐metal enrichment and interfacial solar water sanitation

2. Artificial nanomotors: Fabrication, locomotion characterization, motion manipulation, and biomedical applications

3. Micro-thermoelectric devices

4. Recent advances in thermoelectric technology to harvest energy from the pavement

5. A comprehensive review on Bi ₂ Te ₃ ‐based thin films: Thermoelectrics and beyond

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