Multiblock Copolyimide Exhibiting High Flexibility and Low Thermal Volumetric Expansion owing to Negative Thermal Expansion of PDMS Nanodomain-Reference-Cited by-同舟云学术

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Multiblock Copolyimide Exhibiting High Flexibility and Low Thermal Volumetric Expansion owing to Negative Thermal Expansion of PDMS Nanodomain

Published:2025-06-05 Issue:12 Volume:58 Page:5979-5989
ISSN:0024-9297
Container-title:Macromolecules
language:en
Short-container-title:Macromolecules

Author:

Momoze Atsuto¹,Higashihara Tomoya²^ORCID,Matsuda Naoki²,Maruyama Yoichiro³,Fujitomi Shintarou³,Ando Shinji¹^ORCID,Ishige Ryohei¹^ORCID

Affiliation:

1. Department of Chemical Science and Engineering, Institute of Science Tokyo, 2-12-1-E4-6 Ookayama, Meguro-ku, Tokyo 152-8552, Japan

2. Department of Organic Materials Science, Graduate School of Organic Materials Science, Yamagata University, 4-3-16 Jonan, Yonezawa, Yamagata 992-8510, Japan

3. JSR Corporation, 1-9-2, Higashi-Shimbashi, Minato-ku, Tokyo 105-8640, Japan

Funder

Japan Society for the Promotion of Science

Support for Pioneering Research Initiated by the Next Generation

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.macromol.5c00665

Reference58 articles.

1. Polyimides

2. Advanced polyimide materials: Syntheses, physical properties and applications

3. Dynamic Polyimide Dielectric Film: A Concept and Application Perspective

4. A Subnanosecond Masterslice LSI Using Dielectric Isolation and Three Layer Metallization Technologies

5. Highly reliable a‐IGZO TFTs on a plastic substrate for flexible AMOLED displays

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