Layered Inorganic–Organic 3,5-Dimethylpyrazole-4-Sulfonate Films for Protection of Copper Surfaces against Corrosion

Author:

Al Isawi Wisam A.1,Jianrattanasawat Sarut1,Tripodianos Eleftherios2,Demadis Konstantinos D.2ORCID,Kirillov Alexander M.34,Zeller Matthias5ORCID,Mezei Gellert1ORCID

Affiliation:

1. Department of Chemistry, Western Michigan University, Kalamazoo, Michigan 49008, United States

2. Crystal Engineering, Growth and Design Laboratory, Department of Chemistry, University of Crete, Voutes Campus, Heraklion, Crete GR-71003, Greece

3. Centro de Química Estrutural and Departamento de Engenharia Química, Instituto Superior Técnico, Universidade de Lisboa, Av. Rovisco Pais, 1049-001 Lisbon, Portugal

4. Research Institute of Chemistry, Peoples’ Friendship University of Russia (RUDN University), 6 Miklukho-Maklaya St., Moscow 117198, Russia

5. Department of Chemistry, Purdue University, West Lafayette, Indiana 47907, United States

Funder

Division of Chemistry

European Regional Development Fund

Fundação para a Ciência e a Tecnologia

RUDN University

Publisher

American Chemical Society (ACS)

Subject

Condensed Matter Physics,General Materials Science,General Chemistry

Reference88 articles.

1. (accessed 06/08/2021).

2. Influence of pH and Chloride Concentration on the Corrosion Behavior of Unalloyed Copper in NaCl Solution: A Comparative Study Between the Micro and Macro Scales

3. Federal Highway Administration (FHWA), Office of Infrastructure Research and Development, report FHWA-RD-01-156: Corrosion Cost and Preventive Strategies in the United States, 2001.

4. Corrosion protection of copper and copper alloys in different corrosive medium using environmentally friendly corrosion inhibitors

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