Enhanced Thermal Boundary Conductance across GaN/SiC Interfaces with AlN Transition Layers

Author:

Li Ruiyang1ORCID,Hussain Kamal2,Liao Michael E.3,Huynh Kenny3ORCID,Hoque Md Shafkat Bin4,Wyant Spencer5,Koh Yee Rui4ORCID,Xu Zhihao1ORCID,Wang Yekan3,Luccioni Dorian P.3,Cheng Zhe6ORCID,Shi Jingjing6,Lee Eungkyu7ORCID,Graham Samuel6,Henry Asegun8,Hopkins Patrick E.4910ORCID,Goorsky Mark S.3ORCID,Khan M.Asif2,Luo Tengfei11112ORCID

Affiliation:

1. Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States

2. Department of Electrical Engineering, University of South Carolina, Columbia, South Carolina 29208, United States

3. Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States

4. Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States

5. Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States

6. George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States

7. Department of Electronic Engineering, Kyung Hee University, Yongin-si 17104, Gyeonggi-do, South Korea

8. Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States

9. Department of Materials Science and Engineering, University of Virginia, Charlottesville, Virginia 22904, United States

10. Department of Physics, University of Virginia, Charlottesville, Virginia 22904, United States

11. Department of Chemical and Biomolecular Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States

12. Center for Sustainable Energy of Notre Dame (ND Energy), University of Notre Dame, Notre Dame, Indiana 46556, United States

Funder

Office of Naval Research

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

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