Recent Advances in the Rational Design of Thermal Conductive Polymer Composites
Author:
Affiliation:
1. College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, China
Publisher
American Chemical Society (ACS)
Subject
Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.iecr.0c05509
Reference141 articles.
1. Emerging challenges and materials for thermal management of electronics
2. Nanostructured polymer films with metal-like thermal conductivity
3. Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials
4. Ultrahigh Thermal Conductivity of Interface Materials by Silver-Functionalized Carbon Nanotube Phonon Conduits
5. Polymer/Boron Nitride Nanocomposite Materials for Superior Thermal Transport Performance
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