Current Research and Development Status and Prospect of Hot-Melt Adhesives: A Review-Reference-Cited by-同舟云学术

Current Research and Development Status and Prospect of Hot-Melt Adhesives: A Review

Published:2008-09-24 Issue:20 Volume:47 Page:7524-7532
ISSN:0888-5885
Container-title:Industrial & Engineering Chemistry Research
language:en
Short-container-title:Ind. Eng. Chem. Res.

Author:

Li Wen¹,Bouzidi Laziz¹,Narine Suresh S.¹

Affiliation:

1. Alberta Lipid Utilization Program, Department of Agricultural Food and Nutritional Science, 4−10 Agriculture/Forestry Centre, University of Alberta, Edmonton, Alberta T6G 2P5, Canada

Publisher

American Chemical Society (ACS)

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/ie800189b

Reference91 articles.

1. Hot-Melt Adhesives

2. Development of environmentally friendly warm-melt adhesives for the packaging industry

3. A review of adhesives for furniture

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