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Facilitating 3D Multichip Integration through Low-Temperature Polymer-to-Polymer Bonding

  • Published:2024-05-16 Issue:5 Volume:6 Page:3915-3924
  • ISSN:2637-6113
  • Container-title:ACS Applied Electronic Materials
  • language:en
  • Short-container-title:ACS Appl. Electron. Mater.

Author:

Kim Jihun1ORCID,Hwang Nam Ki2,Hong Seul Ki2,Kim Min Ju234ORCID,Park Jong Kyung1

Affiliation:

1. Department of Semiconductor Engineering, Seoul National University of Science and Technology, Seoul 01811, Republic of Korea

2. Department of Foundry Engineering, Dankook University, 152 Jukjeon-road, Yong-in, Gyeonggi-do 16890, Republic of Korea

3. Department of Semiconductor Convergence Engineering, Dankook University, 152 Jukjeon-road, Yong-in, Gyeonggi-do 16890, Republic of Korea

4. Department of Electronics & Electrical Engineering, Dankook University, 152 Jukjeon-road, Yong-in, Gyeonggi-do 16890, Republic of Korea

Funder

Ministry of Science and ICT, South Korea

Publisher

American Chemical Society (ACS)

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