Three-dimensional thermal analysis of wirelessly powered light-emitting systems

Author:

Zhang Y. H.123,Li Y. H.124,Kim R.-H.5,Tao H.6,Kim T.-I.5,Omenetto F. G.6,Rogers J. A.5,Huang Y.12

Affiliation:

1. Department of Civil/Environmental Engineering, Northwestern University, Evanston, IL 60208, USA

2. Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA

3. Center for Mechanics and Materials, Tsinghua University, Beijing 100084, People's Republic of China

4. School of Astronautics, Harbin Institute of Technology, Harbin 150001, People's Republic of China

5. Department of Materials Science and Engineering, University of Illinois, Urbana, IL 61801, USA

6. Department of Biomedical Engineering, Tufts University, Medford, MA 02155, USA

Abstract

A theoretical model of heat conduction is developed for wirelessly powered microscale inorganic light-emitting diodes (μ-ILEDs). Analytical solutions are obtained for the three-dimensional temperature distribution of each component in the system, which agree reasonably well with the finite-element analyses and experiment results. A simplified scaling law is presented between the non-dimensional temperature of the μ-ILEDs, and the combined geometrical parameters and thermal conductivities of the inductive receiver coil and the substrate. These results provide useful design guidelines for avoiding adverse heating of wireless μ-ILEDs systems, of critical importance for bio-implanted applications.

Publisher

The Royal Society

Subject

General Physics and Astronomy,General Engineering,General Mathematics

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