Bondability and Reliability of Multi-Chip Packages Bonded with Non-Conductive Paste Using Thermal Compression Energy and Ultrasonic Energy-Reference-Cited by-同舟云学术

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Bondability and Reliability of Multi-Chip Packages Bonded with Non-Conductive Paste Using Thermal Compression Energy and Ultrasonic Energy

Published:2017-05-01 Issue:5 Volume:17 Page:2937-2942
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:j nanosci nanotechnol

Author:

Lee J. G¹,Lee J. B²,Myung W. R³,Yoon J. W⁴,Jung S. B¹

Affiliation:

1. School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea

2. Institute of Microelectronics, Agency for Science, Technology and Research, 11Science Park Road, Singapore Science Park II, Singapore 117685, Singapore

3. Sungkyunkwan University Advanced Institute of Nanotechnology, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea

4. Micro-Joining Center, Korea Institute of Industrial Technology, 156 Gaetbeol-ro, Yeonsu-gu, Inchenon 406-840, Republic of Korea

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ultrasonic Bonding Technology for Micro System Integration;Journal of The Japan Institute of Electronics Packaging;2019-08-01

2. Bonding Strength of the Sn-58Bi Jointed IC Card Component Bonded by Ultrasonic Energy;Nanoscience and Nanotechnology Letters;2017-08-01

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