10.1023/A:1004661610307-Reference-Cited by-同舟云学术

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10.1023/A:1004661610307

Published:1999 Issue:17 Volume:34 Page:4133-4139
ISSN:0022-2461
Container-title:Journal of Materials Science
language:
Short-container-title:

Author:

Akatsu T.,Hosoda N.,Suga T.,Rühle M.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Cited by 45 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Progress in the semiconductor/diamond heterogeneous integrations: Technical methods, interfacial phonon transport, and thermal characterizations;Surfaces and Interfaces;2024-03

2. Hybrid Bonding for 3D Integration;Journal of The Japan Institute of Electronics Packaging;2023-07-01

3. Nb–Nb direct bonding at room temperature for superconducting interconnects;Journal of Applied Physics;2023-01-06

4. Experimental study on drawability of aluminium-copper composite in micro deep drawing;Journal of Materials Processing Technology;2022-09

5. Two-Step Ar/N₂ Plasma-Activated Al Surface for Al-Al Direct Bonding;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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