Author:
Furuhashi Takahiro,Yamada Yoshiyasu,Hayashi Masato,Ichihara Shoji,Usui Hiroaki
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science
Reference24 articles.
1. W.L. Tsai, P.C. Hsu, Y. Hwu, C.H. Chen, L.W. Chang, J.H. Je, H.M. Lin, A. Groso, and G. Margaritondo: Electrochemistry: building on bubbles in metal electrodeposition. Nature 417, 139 (2002).
2. P.C. Hsu, S.K. Seol, T.N. Lo, C.J. Liu, C.L. Wang, C.S. Lin, Y. Hwu, C.H. Chen, L.W. Chang, J.H. Je, and G. Margaritondo: Hydrogen bubbles and the growth morphology of ramified zinc by electrodeposition. J. Electrochem. Soc. 155, D400 (2008).
3. H. Vogt and R.J. Balzer: The bubble coverage of gas-evolving electrodes in stagnant electrolytes. Electrochim. Acta 50, 2073 (2005).
4. R.J. Balzer and H. Vogt: Effect of electrolyte flow on the bubble coverage of vertical gas-evolving electrodes. J. Electrochem. Soc. 150, E11 (2003).
5. G.A.D. Bari: Nickel plating. In ASM Handbook Vol. 5: Surface Engineering, edited by C.M. Cotell, J.A. Sprague, and F.A. Smidt Jr. (ASM International, Materials Park, OH, 1994), p. 201.
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