Author:
Baumann F.H.,Chopp D.L.,de la Rubia T. Díaz,Gilmer G.H.,Greene J.E.,Huang H.,Kodambaka S.,O'Sullivan P.,Petrov I.
Abstract
Metallization is the back end of the integrated-circuit (IC) fabrication process where the transistor interconnections are formed. Figure 1 shows the metallized part of a static random-access memory chip. Metal lines for electrical connections (Al and Cu) in Si devices are deposited as blanket films and then etched or polished away to define the conducting lines.
Publisher
Springer Science and Business Media LLC
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,General Materials Science
Cited by
74 articles.
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