Enhanced Thermal and Dielectric Properties of Polyarylene Ether Nitrile Nanocomposites Incorporated with BN/TiO2-Based Hybrids for Flexible Dielectrics

Author:

You Yong12,Chen Siyi12,Yang Shuang12,Li Lianjun12,Wang Pan3

Affiliation:

1. Key Laboratory of General Chemistry of the National Ethnic Affairs Commission, School of Chemistry and Environment, Southwest Minzu University, Chengdu 610041, China

2. Key Laboratory of Pollution Control Chemistry and Environmental Functional Materials for Qinghai-Tibet Plateau of the National Ethnic Affairs Commission, School of Chemistry and Environment, Southwest Minzu University, Chengdu 610041, China

3. School of Mechanical Engineering, Chengdu University, Chengdu 610106, China

Abstract

Outstanding high-temperature resistance, thermal stability, and dielectric properties are fundamental for dielectric materials used in harsh environments. Herein, TiO2 nanoparticles are decorated on the surface of BN nanosheets by internal crosslinking between polydopamine (PDA) and polyethyleneimine (PEI), forming three-dimensional novel nanohybrids with a rough surface. Then, an ether nitrile (PEN) matrix is introduced into the polyarylene to form polymer-based nanocomposite dielectric films. Meanwhile, the structure and micromorphology of the newly prepared nanohybrids, as well as the dielectric and thermal properties of PEN nanocomposites, are investigated in detail. The results indicate that TiO2 nanoparticles tightly attach to the surface of BN, creating a new nanohybrid that significantly enhances the comprehensive performance of PEN nanocomposites. Specifically, compared to pure PEN, the nanocomposite film with a nanofiller content of 40 wt% exhibited an 8 °C improvement in the glass transition temperature (Tg) and a 162% enhancement in the dielectric constant at 1 kHz. Moreover, the dielectric constant–temperature coefficient of the nanocomposite films remained below 5.1 × 10−4 °C−1 within the temperature range of 25–160 °C, demonstrating excellent thermal resistance. This work offers a method for preparing highly thermal-resistant dielectric nanocomposites suitable for application in elevated temperature environments.

Funder

National Natural Science Foundation of China

Natural Science Foundation of Sichuan Province

Southwest Minzu University Research Startup Funds

Publisher

MDPI AG

Subject

Polymers and Plastics,General Chemistry

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