Mitigation of Shape Evolution and Supercapacitive Performance of CuCo2S4 Electrodes Prepared via a Simple Solvent Variation Approach

Author:

Mane Sagar M.1ORCID,Wagh Komal S.2,Teli Aviraj M.3,Beknalkar Sonali A.3,Shin Jae Cheol3,Lee Jaewoong1

Affiliation:

1. Department of Fiber System Engineering, Yeungnam University, 280 Dehak-Ro, Gyeongsan 38541, Republic of Korea

2. Independent Resercher, Gyeongsan 38544, Republic of Korea

3. Division of Electronics and Electrical Engineering, Dongguk University-Seoul, Seoul 04620, Republic of Korea

Abstract

This work demonstrates the evolution of different architectures of Cu-Co bimetallic sulfide on Ni-foam. A simple solvent-changing strategy has been adopted to develop these architectures through a solvothermal approach. When water and ethylene glycol was used as a solvent, the surface of Ni-foam seemed to be covered with a snowflake-like architecture. On the addition of glycerol instead of ethylene glycol, the growth of spongy rectangular prisms from mud-like bricks was initiated. Analyzing electrochemically, both electrodes deliver excellent capacitance. The electrode developed with water and glycerol was found to be richer in terms of capacitive performance, which gives 1459.7 F/gm (5692.8 mF/cm2) at a higher current density of 5 mA/cm2. An over-33% increment in capacitance was noted when compared with the specific capacitance (areal capacitance) of another electrode which can provide 986.6 F/gm (3157 mF/cm2) at the same current density. Both electrodes are richer in terms of providing higher rate capability above 75%, even if the current density is increased by three times. Furthermore, both electrodes deliver long-lasting storage capability, with above 80% capacitance retention over 10,000 charge–discharge cycles even at a higher current density of 60 mA/cm2. This simple solvent-changing approach can be useful for developing electrode materials with outstanding capacitive performance.

Funder

Korea Institute for Advancement of Technology

Korea Government

National Research Foundation of Korea

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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