Enhanced Mechanical Properties of PUMA/SiO2 Ceramic Composites via Digital Light Processing

Author:

Kang Jiwan1ORCID,Park Seong Hyeon2,Park Keun13ORCID

Affiliation:

1. Institute of 3D Printing Convergence Technology, Seoul National University of Science and Technology, Seoul 01811, Republic of Korea

2. Material Research Center, Carima Co., Ltd., Seoul 07532, Republic of Korea

3. Department of Mechanical System Design Engineering, Seoul National University of Science and Technology, Seoul 01811, Republic of Korea

Abstract

This study aims to enhance the mechanical properties of additively manufactured polymer parts by incorporating ceramic particles (SiO2) into diluted urethane methacrylate (UDMA) photopolymer resin using digital light processing (DLP) technology. The resulting PUMA/SiO2 composites, featuring varying SiO2 contents (16.7, 28.5, and 37.5 wt%) and processed under different conditions, underwent a comprehensive series of mechanical, thermal, and chemical tests. Hardness tests showed that composites with 37.5 wt% SiO2 demonstrated superior hardness with low sensitivity to processing conditions. Bending tests indicated that elevated vat temperatures tended to degrade flexural properties, yet this degradation was mitigated in the case of the 37.5 wt% SiO2 composition. Tensile tests revealed a transition from viscoelastic to linear elastic behaviors with increasing SiO2 content, with high tensile strength sustained at low vat temperatures (<35 °C) when the SiO2 content exceeded 28.5 wt%. Thermogravimetric analysis supported these findings, indicating that increased SiO2 content ensured a more uniform dispersion, enhancing mechanical properties consequently. Thermal tests showed augmented thermal conductivity and diffusivity with reduced specific heat in SiO2-inclusive composites. This study provides guidelines for optimal PUMA/SiO2 composite utilization that emphasizes high SiO2 content and low vat temperature, offering comprehensive insights for high-performance ceramic composite fabrication in functional applications.

Funder

Ministry of Science and ICT, Republic of Korea

Publisher

MDPI AG

Subject

Polymers and Plastics,General Chemistry

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