Press Conduction Welding for Secondary Bonding of Aircraft Skin/Stiffener Assemblies Using Carbon Fiber/PEKK Thermoplastic Composites and PEI Adhesive

Author:

Choi Hyunseok1ORCID,Lee Chan-Joo2,Jeon Yong-Jun2,Choi Woo-Chun1,Kim Dongearn2ORCID

Affiliation:

1. Department of Mechanical Engineering, Korea University, Seoul 02841, Republic of Korea

2. Korea Institute of Industrial Technology (KITECH), Incheon 21999, Republic of Korea

Abstract

This study investigates the secondary bonding of aircraft skin/stiffener assemblies using press conduction welding with carbon fiber/polyetherketoneketone thermoplastic composites and polyetherimide adhesive. Recognizing the challenges posed by conventional welding methods in maintaining material integrity and uniformity, this research explores an alternative methodology that mitigates these issues while ensuring high-strength bonds. The press conduction welding parameters were selected based on single-lap shear tests and applied in the bonding of skin and omega stiffener components. The temperature range was determined using differential scanning calorimetry. The pressure was held at 1 MPa for 180 s. The welding temperature that produced a high-bonding strength was identified experimentally; these key variables were then used in the welding process of the skin and omega stiffener. By analyzing how the fibers tear and the effectiveness of interdiffusion between the plies, we were able to gain insights into the bonding strength and fractured surface. The findings suggest that press conduction welding provides a viable route for secondary bonding in thermoplastic composite structures, highlighting its advantages in terms of processing efficiency and integrity. This study contributes to the understanding of the mechanical behaviors of bonded joints and underscores the significance of temperature control in the welding process.

Funder

Ministry of Trade, Industry and Energy (MOTIE) and Korea Evaluation Institute of Industrial Technology (KEIT) through the Helicopter Electric Multiple Tail Rotor Technology R&D program

Publisher

MDPI AG

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