Analytical Thermal Analysis of Radially Functionally Graded Circular Plates with Coating or Undercoating under Transverse and Radial Temperature Distributions

Author:

Chung Yen-Ling1,Lin Zong-Han1

Affiliation:

1. Department of Construction Engineering, National Taiwan University of Science and Technology, Section 4, 43 Keelung Road, Taipei 106335, Taiwan

Abstract

This study aims to provide analytical solutions for circular plates coated or undercoated with functionally graded materials (FGMs) having Young’s modulus functionality through the radius. The circular plates are subjected to thermal loads in radial and thickness directions. Because of the uncoupled stretching–bending problem of the radially FGM circular plate, the bending equilibrium equations in terms of displacements of the FGM-coated or -undercoated circular plates with Young’s modulus based on the power–law function were established individually. General solutions for the homogeneous portion or FGM ring of the radially FGM-coated or -undercoated circular plate were developed separately. Subsequently, analytical thermal solutions for the radially FGM-coated or -undercoated circular plate were evaluated by solving the simultaneous boundary and continuity conditions equations. The analytical results were validated by comparing them with finite element solutions. When degenerated, they coincided with those of the homogeneous circular plate in the literature, enhancing the obtained solutions’ reliability. These analytical solutions provide valuable insights into the plates’ responses and expand the understanding of their mechanical behaviors under thermal loads. Furthermore, the effects of the FGM thickness, the material index, and the thermal loading conditions on the mechanical behaviors were under investigation. This parameter study offers valuable perspectives into the influence of these factors on the plate’s structural response and aids in the optimization and design of FGM-coated or -undercoated circular plates.

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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