Design and Fabrication of 3.5 GHz Band-Pass Film Bulk Acoustic Resonator Filter

Author:

Zhou Yu1ORCID,Zheng Yupeng1,Xu Qinwen1,Qu Yuanhang1,Ren Yuqi1,Huang Xiaoming2,Gao Chao1,Liu Yan1ORCID,Guo Shishang2ORCID,Cai Yao1ORCID,Sun Chengliang13ORCID

Affiliation:

1. The Institute of Technological Sciences, Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan 430072, China

2. School of Physics & Technology, Wuhan University, Wuhan 430072, China

3. Wuhan Institute of Quantum Technology, Wuhan 430072, China

Abstract

With the development of wireless communication, increasing signal processing presents higher requirements for radio frequency (RF) systems. Piezoelectric acoustic filters, as important elements of an RF front-end, have been widely used in 5G-generation systems. In this work, we propose a Sc0.2Al0.8N-based film bulk acoustic wave resonator (FBAR) for use in the design of radio frequency filters for the 5G mid-band spectrum with a passband from 3.4 to 3.6 GHz. With the excellent piezoelectric properties of Sc0.2Al0.8N, FBAR shows a large Keff2 of 13.1%, which can meet the requirement of passband width. Based on the resonant characteristics of Sc0.2Al0.8N FBAR devices, we demonstrate and fabricate different ladder-type FBAR filters with second, third and fourth orders. The test results show that the out-of-band rejection improves and the insertion loss decreases slightly as the filter order increases, although the frequency of the passband is lower than the predicted ones due to fabrication deviation. The passband from 3.27 to 3.47 GHz is achieved with a 200 MHz bandwidth and insertion loss lower than 2 dB. This work provides a potential approach using ScAlN-based FBAR technology to meet the band-pass filter requirements of 5G mid-band frequencies.

Funder

Young Scientists Fund of the National Natural Science Foundation of China

National Key R&D Program of China

Fundamental Research Funds for the Central Universities

Open Fund of Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration (Wuhan University)

Publisher

MDPI AG

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