Abstract
Thermal management at a high heat flux is crucial for high-power electronic devices, and jet impingement cooling is a promising solution. In this paper, a hybrid heat sink combining a microchannel and jet impingement was designed, fabricated and tested in a closed-loop system with R134a as the working fluid. The thermal contact resistance was measured by using the steady-state method, and the thermal resistance of the heat sink was obtained at different heat fluxes and flow rates. The maximum heat dissipation of 400 W/cm2 is achieved on a heater area of 210 mm2, and the thermal resistance of the heat sink is 0.11 K/W with a pressure drop of 13.5 kPa under a flow rate of 1.90 L/min. Low thermal resistance can be achieved for the hybrid heat sink stemming from the highly-dense micro-jet array with separate inflow and outflow microchannels.
Funder
National Natural Science Foundation of China
Youth Innovation Team of Shaanxi Universities and Xi’an Jiaotong University Special Research Project
Subject
Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science
Reference40 articles.
1. Liu, X., Zhao, W., Xiong, L., and Liu, H. (2015). Packaging of High Power Semiconductor Lasers, Springer.
2. Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations;Mudawar;J. Electron. Packag.,2011
3. Flow boiling in microchannel with synthetic jet in cross-flow;Sourtiji;Int. J. Heat Mass Transf.,2020
4. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981
5. Simulation of micro-channel heat sinks for optoelectronic microsystems;Kreutz;Microelectron. J.,2000
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