Affiliation:
1. State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi’an 710071, China
2. The 58th Research Institute of China Electronics Technology Group Corporation, Wuxi 214000, China
3. The Fifth Electronics Research Institute of Ministry of Industry and Information Technology, Guangzhou 510000, China
Abstract
With the advancement of Moore’s Law reaching its limits, advanced packaging technologies represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and 3D packaging have received significant attention. While advanced packaging has made breakthroughs in achieving high performance, miniaturization, and low cost, the smaller thermal space and higher power density have created complex physical fields such as electricity, heat, and stress. The packaging interconnects responsible for electrical transmission are prone to serious reliability issues, leading to the device’s failure. Therefore, conducting multi-field coupling research on the reliability of advanced packaging interconnects is necessary. The development of packaging and the characteristics of advanced packaging are reviewed. The reliability issues of advanced packaging under thermal, electrical, and electromagnetic fields are discussed, as well as the methods and current research of multi-field coupling in advanced packaging. Finally, the prospect of the multi-field coupling reliability of advanced packaging is summarized to provide references for the reliability research of advanced packaging.
Funder
Research Program of the National Key Laboratory of Advanced Micro and Nano Manufacture Technology
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