Measurement of Effects of Different Substrates on the Mechanical Properties of Submicron Titanium Nickel Shape Memory Alloy Thin Film Using the Bulge Test

Abstract

This study investigated the effects of different substrates on the mechanical properties of Ti-60at%Ni shape memory alloys (SMA). Two types of samples were prepared for this experiment: (1) a Ti-60at%Ni deposited on SiNx, and (2) a Ti-60at%Ni deposited on SiNx/Cr; both had a 600 nm thick film of Ti-60at%Ni. Deposition was done using the physical vapor deposition (PVD) process, and the microstructural changes and crystallization phase changes were observed through scanning electron microscopy (SEM) and X-ray diffraction (XRD). The results showed that the TiNi thin film with a Cr adhesion layer had better mechanical properties. The bulge test showed that TiNi thin film with a Cr adhesion had a higher Young’s modulus and lower residual stress. From the thermal cycling experiment, it was found that the Cr adhesion layer buffered the mismatch between TiNi and SiNx. Additionally, the thermal cycling test was also used to measure the thermal expansion coefficient of the films, and the fatigue test showed that the Cr layer significantly improved the fatigue resistance of the TiNi film.