Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices

Abstract

Due to its higher energy and smaller heating area, laser joining technology is widely used in aluminum alloy welding and other industrial fields, which meets the solder sealing requirements for electronic packaging. According to experiments, cracks were prone to occur at the corners and spot-welding positions near the weld. In this paper, the depth and width of the melt pool were measured experimentally, and the results were used to calibrate and validate the heat source model. An empirical relationship between heat source parameters and melt pool morphology is presented. The heat source model of laser deep penetration welding was established under the same experimental conditions. And the results were in agreement with the experimental results. The finite element method was used to numerically simulate the welding process of a 50%SiAl shell and a 27%SiAl cover plate. The effects of different spot-welding sequences and numbers on the residual stress and cracking possibility of laser welded samples were analyzed. The results show that under sequential spot-welding, when the amount of spot-welding is increased, the stress peak value decreases. Compared with sequential spot welding and side-by-side spot welding, the spot-welding sequence of diagonal points first, and then side-by-side spot welding, can effectively reduce the residual stress. This research enables us to provide some guidelines in terms of studying the reliability issues of microwave devices.