Research on the Capillary Filling Behavior of Liquid Solder Al-12Si under the Action of Electromagnetic Ultrasonic Wave

Author:

Chen Guijuan1,Gao Qianqian1,Zhang Mingxuan1,Yu Haonan1

Affiliation:

1. School of Mechanical Science and Engineering, Northeast Petroleum University, Daqing 163318, China

Abstract

To address the issues of high cost, low welding efficiency, and complex processes in vacuum brazing, we proposed a method of electromagnetic ultrasonic (EU)-assisted brazing with Al-12Si solder to join SiC ceramic and TC4 alloy. The results showed that the maximum magnetic induction strength (MIS) on the surface of the liquid solder was 0.629 T when subjected to a static and alternating magnetic field (MF). Additionally, the combined action of MF and eddy current generated a downward Lorentz force (LF) in the liquid solder, with the maximum LF in the horizontal and vertical directions being 48.91 kN m−3 and 60.93 kN m−3, respectively. Under the influence of an EU wave, the liquid solder exhibited capillary filling (CF) behavior. At 26 ms, the maximum length of CF was 12.21 mm.

Publisher

MDPI AG

Reference43 articles.

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