A Nanoporous 3D-Printed Scaffold for Local Antibiotic Delivery

Author:

Ahangar Pouyan1,Li Jialiang2,Nkindi Leslie S.2,Mohammadrezaee Zohreh2,Cooke Megan E.1,Martineau Paul A.1,Weber Michael H.1,Saade Elie2,Nateghi Nima2ORCID,Rosenzweig Derek H.13ORCID

Affiliation:

1. Department of Surgery, McGill University, Montreal, QC H3G 1A4, Canada

2. Department of Science, TAV College, Montreal, QC H3W 3E1, Canada

3. Injury, Repair and Recovery Program, Research Institute of McGill University Health Centre, Montreal, QC H3G 1A4, Canada

Abstract

Limitations of bone defect reconstruction include poor bone healing and osteointegration with acrylic cements, lack of strength with bone putty/paste, and poor osteointegration. Tissue engineering aims to bridge these gaps through the use of bioactive implants. However, there is often a risk of infection and biofilm formation associated with orthopedic implants, which may develop anti-microbial resistance. To promote bone repair while also locally delivering therapeutics, 3D-printed implants serve as a suitable alternative. Soft, nanoporous 3D-printed filaments made from a thermoplastic polyurethane and polyvinyl alcohol blend, LAY-FOMM and LAY-FELT, have shown promise for drug delivery and orthopedic applications. Here, we compare 3D printability and sustained antibiotic release kinetics from two types of commercial 3D-printed porous filaments suitable for bone tissue engineering applications. We found that both LAY-FOMM and LAY-FELT could be consistently printed into scaffolds for drug delivery. Further, the materials could sustainably release Tetracycline over 3 days, independent of material type and infill geometry. The drug-loaded materials did not show any cytotoxicity when cultured with primary human fibroblasts. We conclude that both LAY-FOMM and LAY-FELT 3D-printed scaffolds are suitable devices for local antibiotic delivery applications, and they may have potential applications to prophylactically reduce infections in orthopedic reconstruction surgery.

Funder

RI MUHC Start-up funds

TAV College internal support funds and Mitacs scholarships

NSERC Discovery

CIHR postdoctoral fellowship

doctoral fellowship from RI MUHC

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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