Impact of Millimeter-Size Silicon Microchips on the Mechanical Properties of Polymer Samples Tested under Flexural Bending, Long-Term Creep, and Impact Conditions

Author:

Kolonko Anna Magdalena1,Metje Nicole2,Chapman David Neil3,Kukureka Stephen N.4

Affiliation:

1. Former Research Student, School of Civil Engineering, College of Engineering and Physical Sciences, Univ. of Birmingham, Edgbaston, Birmingham, B15 2TT, UK.

2. School of Civil Engineering, College of Engineering and Physical Sciences, Univ. of Birmingham, Edgbaston, Birmingham, B15 2TT, UK (corresponding author).

3. School of Civil Engineering, College of Engineering and Physical Sciences, Univ. of Birmingham, Edgbaston, Birmingham, B15 2TT, UK.

4. School of Metallurgy and Materials, College of Engineering and Physical Sciences, Univ. of Birmingham, Edgbaston, Birmingham, B15 2TT, UK.

Publisher

American Society of Civil Engineers (ASCE)

Subject

Mechanical Engineering,Civil and Structural Engineering

Reference31 articles.

1. ASTM. (2001). “Standard test methods for tensile compressive and flexural creep and creep rupture of plastics.” D2990-2001 West Conshocken PA.

2. ASTM. (2007). “Standard test methods for flexural properties of unreinforced and reinforced plastics and electrical insulating materials.” D790-2007 West Conshohocken PA.

3. British Standards Insititute (BSI). (2001). “Plastics. Determination of Charpy impact properties. Non-instrumented impact test.” BS EN ISO 179-1:2001 UK.

4. British Standards Insititute (BSI). (2003a). “Plastics. Determination of flexural properties.” BS EN ISO 178:2003 UK.

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