Author:
Nishimura Tetsuro,Nakagawa Yasutada
Subject
Fluid Flow and Transfer Processes,Condensed Matter Physics
Reference3 articles.
1. For example, et al. Proc Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack'97, p 1059-1064.
2. The Curing Process Analysis for Epoxy Resin Casting. Analysis of Temperature and Viscosity in Nonisothemral Process.
3. Heat transfer. Rikougakusha; 1982. p 173.
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