Enhancing cryogenic thermal conductivity of epoxy composites through the incorporation of boron nitride nanosheets/nanodiamond aerogels prepared by directional‐freezing method

Abstract

AbstractIn the realm of electronic circuits, materials with high thermal conductivity are sought after as ideal packaging components. It is crucial that such materials not only possess excellent thermal conductivity, but also maintain desirable dielectric properties. To this end, boron nitride nanosheets (BNNS) and BNNS/nanodiamond (ND) aerogels with a three‐dimensional (3D) structure using the ice‐template method were prepared. Subsequently, these aerogels were utilized as a framework to produce 3D‐BNNS/epoxy and 3D‐BNNS/ND/epoxy composites via the vacuum‐assisted impregnation method, which exhibit enhanced anisotropic thermal conductivity. Furthermore, the thermal conductivity exhibited by the 3D‐BNNS/epoxy composites outperforms those containing randomly distributed BNNS. The experiment also reveals sintering the aerogel at elevated temperatures to remove the PVA can significantly improve the thermal conductivity exhibited by the 3D‐BNNS/epoxy and 3D‐BNNS/ND/epoxy composites. Importantly, the 3D‐BNNS/ND/epoxy composites illustrate exceptional thermal conductivity values of 1.326 W/(m·K), indicating a remarkable synergistic effect of BNNS and ND in improving thermal conductivity. It is noteworthy to state that the relative thermal conductivity ratio of the 3D‐BNNS/epoxy and 3D‐BNNS/ND/epoxy composites to pure epoxy resin was markedly higher at lower temperatures than the values measured at room temperature, signifying their superior heat transfer performance at lower temperatures. In addition, the composites depict excellent dielectric properties and lower coefficients of thermal expansion values. Finally, the 3D‐BNNS/ND/epoxy composites also have significantly improved Tg (132.5 and 152.6°C). The high‐performance polymer composites described in this study are envisaged for implementation within the realm of electronic packaging materials.