Ultrathin Silicon Circuits With Strain-Isolation Layers and Mesh Layouts for High-Performance Electronics on Fabric, Vinyl, Leather, and Paper-Reference-Cited by-同舟云学术

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Ultrathin Silicon Circuits With Strain-Isolation Layers and Mesh Layouts for High-Performance Electronics on Fabric, Vinyl, Leather, and Paper

Published:2009-09-25 Issue:36 Volume:21 Page:3703-3707
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Adv. Mater.

Author:

Kim Dae-Hyeong,Kim Yun-Soung,Wu Jian,Liu Zhuangjian,Song Jizhou,Kim Hoon-Sik,Huang Yonggang Y.,Hwang Keh-Chih,Rogers John A.

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/adma.200900405/fullpdf

Reference35 articles.

1. Macroelectronics: Perspectives on Technology and Applications

2. Stretchable Interconnects for Elastic Electronic Surfaces

3. Microsolidics: Fabrication of Three-Dimensional Metallic Microstructures in Poly(dimethylsiloxane)

4. Integration of Organic FETs With Organic Photodiodes for a Large Area, Flexible, and Lightweight Sheet Image Scanners

5. Conformable, flexible, large-area networks of pressure and thermal sensors with organic transistor active matrixes

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