Self-Assembly Process to Integrate and Connect Semiconductor Dies on Surfaces with Single-Angular Orientation and Contact-Pad Registration-Reference-Cited by-同舟云学术

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Self-Assembly Process to Integrate and Connect Semiconductor Dies on Surfaces with Single-Angular Orientation and Contact-Pad Registration

Published:2006-06-06 Issue:11 Volume:18 Page:1387-1392
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Adv. Mater.

Author:

Zheng W.,Jacobs H. O.

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference25 articles.

1. Self-Assembly of 10-μm-Sized Objects into Ordered Three-Dimensional Arrays

2. R. S. Fearing, presented at the IEEE/RSJ Int. Conf. on Intelligent Robots and Systems, Pittsburgh, PA, USA, August 1995.

3. Fabrication of novel biomaterials through molecular self-assembly

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