Review of polymer materials with low dielectric constant
Author:
Publisher
Wiley
Subject
Polymers and Plastics,Materials Chemistry,Organic Chemistry
Reference63 articles.
1. Analysis of Cu/Low-k structure under back end of line process
2. Porosity and structure evolution of a SiOCH low k material during post-etch cleaning process
3. Characterization of low-k SiOCH dielectric for 45nm technology and link between the dominant leakage path and the breakdown localization
4. Evaluation of a PECVD advanced barrier (k=3.7) for 32nm CMOS technology and below
5. A method of fabricating metal-insulator-metal (MIM) capacitor in Cu/low-k backend interconnection process for RF application
Cited by 179 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Semiaromatic Poly(ester imide) Copolymers with Alicyclic Diamines for Low-K Properties at a High Frequency of 10–40 GHz;ACS Applied Polymer Materials;2024-09-09
2. High-frequency 5G substrate: Low dielectric biphenyl polyimide with low CTE and high thermal stability;Materials Today Advances;2024-08
3. Investigation in the Influence of the Composition of Metal Ferrite Based Composites on the Dielectric Constant Through Response Surface Methodology;Journal of The Institution of Engineers (India): Series D;2024-06-06
4. High thermal conductivity and low dielectric polyimide nanocomposites using diamine-assisted mechanochemical exfoliation boron nitride and in-situ polymerization under pressure;Chemical Engineering Journal;2024-05
5. Dvelopment of novel low dielectric epoxy resin;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3