Emerging Solid–State Thermal Switching Materials

Author:

Jia Junjun1ORCID,Li Shuchen2,Chen Xi2,Shigesato Yuzo3

Affiliation:

1. Global Center for Science and Engineering (GCSE) Faculty of Science and Engineering Waseda University 3‐4‐1 Okubo Shinjuku Tokyo 169‐8555 Japan

2. Department of Electrical and Computer Engineering University of California Riverside Riverside CA 92521 USA

3. Graduate School of Science and Engineering Aoyama Gakuin University 5‐10‐1 Fuchinobe, Chuo Sagamihara Kanagawa 252‐5258 Japan

Abstract

AbstractGrowing technical demand for thermal management stems from the pursuit of high–efficient energy utilization and the reuse of wasted thermal energy, which necessitates the manipulation of heat flow with electronic analogs to improve device performance. Here, recent experimental progress is reviewed for thermal switching materials, aiming to achieve all–solid–state thermal switches, which are an enabling technology for solid–state thermal circuits. Moreover, the current understanding for discovering thermal switching materials is reshaped from the aspect of heat conduction mechanisms under external controls. Furthermore, current challenges and future perspectives are provided to highlight new and emerging directions for materials discovery in this continuously evolving field.

Funder

Waseda University

National Science Foundation

Publisher

Wiley

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