Method for Fabricating Multilevel Interconnection Structures Using Differential Delamination Energies between Metal and Silicon Oxide Thin Films

Author:

AONO TAKANORI1,IWASAKI TOMIO1,YOSHIMURA YASUHIRO1,NAKAYAMA YOSHINORI2

Affiliation:

1. Hitachi, Ltd; Hitachi Research Laboratory; Japan

2. Hitachi, Ltd; Central Research Laboratory; Japan

Publisher

Wiley

Subject

Applied Mathematics,Electrical and Electronic Engineering,Computer Networks and Communications,General Physics and Astronomy,Signal Processing

Reference12 articles.

1. Jiang H Li Z Tien NC Reducing silicon-substrate parasitics of on-chip transformers 649 652 2002

2. Yoon JB Kim BI Choi YS Yoon E 3-D Lithography and metal surface micromachining for RF and microwave MEMS 673 676 2002

3. John JK Kim E Tu H Zhang J Loeb JA, Xu Y. Multifunctional chronic 3D Electrode arrays based on a simple folding process 1476 1479 2013

4. Xuan F Luo X Hsing IM A new solution-phase electrochemical DNA detection platform with target recycling-based signal amplification 761 763 2012

5. Osaka T Yoshino M Electrochemical deposition process for ULSI interconnection devices, in Modern electroplating, 5th edition 2010 369 382

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