Efficient preparation of polydimethylsiloxane‐based phase change composites with sandwich structure

Author:

An Yi1,Li Chenglin1,Li Ning1,Wang Shengli1,Li Yajiao1,Wang Wenhao1,Qiu Siyuan1,Wu Daming12,Ma Yane1,Gao Dali3,Sun Jingyao12ORCID

Affiliation:

1. College of Mechanical and Electrical Engineering Beijing University of Chemical Technology Beijing China

2. State Key Laboratory of Organic‐Inorganic Composites Beijing University of Chemical Technology Beijing China

3. SINOPEC Beijing Research Institute of Chemical Industry Beijing China

Abstract

AbstractWith the rapid development of portable electronic devices, there is an urgent need for the multifunctional composites like excellent electromagnetic interference (EMI) shielding performance, mechanical property, and thermal management capabilities. Here, due to the low thermal conductivity of phase change materials (PCMs), a sandwich structure carbon nanotube/phase change microcapsule/carbon nanotube (CNT/PMC/CNT (CPC)) film was prepared by vacuum‐assisted filtration (VAF) method. CNT, PMC, and cellulose nanocrystal (CNC) were used as functional fillers. The addition of CNCs was used to improve the mechanical performance of CPC film. Compared with PMC‐CNC (PC) film, CPC film with sandwich structure prevented leakage phenomenon efficiently. Subsequently, the use of ultrasonic‐assisted forced infiltration (UAFI) successfully infiltrated polydimethylsiloxane (PDMS) matrix in the filler skeleton to obtain CNT/PMC/CNT/PDMS (CPCP) composites. When filler mass ratio (CNT: CNC and PMC: CNC) reached 10:1, the thermal conductivity of CPCP composites was 2.32 W/(m·K) and total EMI shielding effectiveness (EMI SET) of it with 0.38 mm thickness reached 37.46 dB at 12.4 GHz. Besides, these sandwich composites exhibited the good mechanical properties and heat storage capacity. And we systematically observed the impact of different addition amounts of PC homogeneous dispersing solution on phase change ability of CPCP10:1 composites. In summary, CPCP phase change composites with sandwich structure shows potential application prospect in thermal management materials with EMI shielding of electronic devices.Highlight The sandwich structure CPCP composites prepared by the combination of VAF and UAFI method, showing superior thermal conductivity and phase change ability. CPCP has excellent EMI shielding performance, which can meet the need of TMMs with EMI shielding performance. Compared with same thickness PC film, sandwich CPC film can prevent leakage phenomenon efficiently.

Funder

National Natural Science Foundation of China

Publisher

Wiley

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