Low‐Temperature Flexible Integration of All‐Solid‐State Thin‐Film Lithium Batteries Enabled by Spin‐Coating Electrode Architecture

Author:

Ke Bingyuan123,Cheng Shoulin1,Zhang Congcong1,Li Wangyang1,Zhang Jie1,Deng Renming1,Lin Jie4,Xie Qingshui4,Qu Baihua5,Qiao Li6,Peng Dong‐Liang4,Wang Xinghui123ORCID

Affiliation:

1. College of Physics and Information Engineering Institute of Micro‐Nano Devices and Solar Cells Fuzhou University Fuzhou 350108 China

2. Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China Fuzhou Fujian 350108 China

3. Jiangsu Collaborative Innovation Center of Photovoltaic Science and Engineering Changzhou 213000 China

4. College of Materials Xiamen University Xiamen 361005 China

5. College of Materials Science and Engineering Chongqing University Chongqing 400044 China

6. School of Mathematics and Physics Qinghai University Xining 810016 China

Abstract

AbstractMicro energy sources as the nucleus of intelligent microdevices guarantee their full autonomy in the dimensions of time and space. However, the state‐of‐the‐art micro energy storage components, like all‐solid‐state thin‐film microbatteries (ASSTFBs), whose direct integration is impeded by the stereotyped vacuum‐based manufacturing technologies, for which an inevitable high‐temperature annealing step (> 500 °C) can exert catastrophic effects on the attached microdevices during the crystallization of manufactured insertion thin‐film cathodes, especially in flexible integration. Herein, a prototype construction is created to benchmark concrete feasibility for the low‐temperature manufacturing of ASSTFBs via a nonvacuum‐based spin‐coating electrode architecture. Results show that the spin‐coated LiFePO4 films enable low‐temperature (≈ 45 °C) manufacturing of ASSTFBs, by which it can deliver excellent cycling performance up to 1000 cycles. Importantly, this technology presents the versatility of integrating various cathode composites into ASSTFBs and is therefore generalized to the LiCoO2‐ and Li4Ti5O12‐based solid‐state chemistries. Furthermore, ASSTFBs with such compliant electrodes manifest outstanding flexibility without pronounced capacity degradation by successfully integrating on flexible temperature‐sensitive substrates. The spin‐coating protocol provides a general solution for excessive processing temperatures and ample opportunities for the development of on‐chip integratable and flexible ASSTFBs.

Funder

National Natural Science Foundation of China

Natural Science Foundation of Fujian Province

Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China

Publisher

Wiley

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