Preparation, thermal and mechanical properties of POSS epoxy hybrid composites
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference19 articles.
1. Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability
2. Study and characterization on the nanocomposite underfill for flip chip applications
3. Nanobuilding blocks based on the [OSiO1.5]x (x= 6, 8, 10) octasilsesquioxanes
4. Facile, high yield synthesis of functionalized spherosilicates: precursors of novel organolithic macromolecular materials
5. Silsesquioxanes as Synthetic Platforms. 3. Photocurable, Liquid Epoxides as Inorganic/Organic Hybrid Precursors
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