Accelerated‐curing epoxy structural film adhesive for bonding lightweight honeycomb sandwich structures
Author:
Affiliation:
1. Institute of Petrochemistry, Heilongjiang Academy of Sciences Harbin China
2. College of Material Science and Chemical Engineering, Harbin Engineering University Harbin China
Funder
Natural Science Foundation of Heilongjiang Province
China Postdoctoral Science Foundation
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/app.53458
Reference44 articles.
1. A comparative study on the rheological, thermal, and mechanical performance of epoxy resin modified with thermoplastics
2. Surface Treatment of Composites with Bismaleimide Resin-Based Wet Peel Ply for Enhanced Adhesive Bonding Performance
3. Properties and structure of high temperature resistant cyanate ester/polyethersulfone blends using solvent-free toughening approach
4. Structure and properties of polyimide/sericite composite adhesive prepared bypolyamide acid salt method
5. Toughening of benzoxazine structural adhesives and surface films
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