UV curable pressure-sensitive adhesives for fabricating semiconductors. II. The effect of functionality of acrylate monomers on the adhesive properties-Reference-Cited by-同舟云学术

UV curable pressure-sensitive adhesives for fabricating semiconductors. II. The effect of functionality of acrylate monomers on the adhesive properties

Published:2004 Issue:6 Volume:93 Page:2889-2895
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Horigome Katsuhiko,Ebe Kazuyoshi,Kuroda Shin-ichi

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference14 articles.

1. UV curable pressure-sensitive adhesives for fabricating semiconductors. I. Development of easily peelable dicing tapes

2. Acrylate Copolymer/Ultraviolet Curable Oligomer Blends as Pressure-sensitive Adhesives

Cited by 39 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Delayed‐onset UV‐curable adhesives with long‐term storage stability by Michael addition reaction between multifunctional acrylate and acetoacetic acid esters using photobase generators;Journal of Polymer Science;2024-01-09

2. A novel CO2 based UV-induced peelable adhesive for wafer dicing;Progress in Organic Coatings;2023-11

3. Photomelt and photoinduced tacky resins comprising disulfide and photoinitiators as easy-to-release, pressure-sensitive, and separator-free adhesives;Chemical Engineering Journal;2023-09

4. Preparation of UV Debonding Acrylate Adhesives by a Postgrafting Reaction;Materials;2023-08-29

5. Fabrication of UV-induced peelable adhesives using acrylic copolymers containing photo-initiators and soybean oil based urethane acrylate oligomers;International Journal of Adhesion and Adhesives;2023-08