Fabrication of Flexible Copper Microelectrodes Using Laser Direct Writing for Sensing Applications

Author:

Cheng Jian12,Liu Xin1,Kong Weichang1,Lei Qingzheng1,Yu Zhiyu1,Liu Dun12ORCID

Affiliation:

1. Laser Group School of Mechanical Engineering Hubei University of Technology Wuhan 430068 China

2. Hubei Key Laboratory of Modern Manufacturing Quality Engineering Wuhan 430068 China

Abstract

The fabrication of flexible electronics has gained extensive attention due to the growing demand of flexible devices. Among various methods, laser direct writing technology has emerged as a promising approach due to its advantages of high processing accuracy and simplicity. This research focuses on the preparation of copper microelectrodes using laser‐induced reduction of CuO nanoparticles (Cu NPs) on polyethylene terephthalate films. First, the influence of various parameters on the conductivity of the copper microelectrodes is investigated. Second, flexible copper microelectrodes with a minimum resistivity of 62.29 μΩ cm and an adhesion grade of 4B level are successfully fabricated. Building upon these results, a capacitive pressure sensor is developed with optimal sensitivity of 3.99 Pa−1, good hysteresis of 3.99%, and response and recovery times of 1.2 and 1.3 s, respectively. Repeatability tests confirm the sensor's stability and fatigue resistance. This research provides valuable insights for the production of flexible sensors.

Publisher

Wiley

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